Standard Test Method for
Exothermic Temperature of Encapsulating Compounds for
Electronic and Microelectronic Encapsulation1
This standard is issued under the fixed designation F 542; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
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