Standard Test Methods for
Copper-Clad Thermosetting Laminates for Printed Wiring
Boards1
This standard is issued under the fixed designation D 5109; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval
Click below to download Astm D 5109 – 99 Pdf free
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Click here to AstmD 5108 – 90 (Reapproved 2002) Pdf free download